設計營商周（BODW）2019
亞洲年度矚目盛事設計營商周（BODW）將於2019年12月2至7日於香港舉行，屆時將匯聚世界各地的設計大師及極具影響力的商界領袖，全面探索設計、創新及品牌趨勢。今年的伙伴國家是創意行業持續發展蓬勃的世界文化大國 ── 英國，以「Designing the Future, Create Tomorrow」為主題。從時裝、電影、建築乃至廣告範疇，英國創意人才一直以挑戰傳統和意念前衛的匠心而蜚聲國際，不少潮流預測專家亦公認英國是孕育新興潮流邁向全球的關鍵市場之一。
BODW 2019獲得英國創意大師和環球精英踴躍參與，將舉行一系列論壇和討論環節，探討品牌、傳意、產品設計、數碼和科技、空間設計和建築、文化，以至城市生活的最新趨勢和創新意念。是次峰會為商界和創意領袖建構了一個極具規模的平台，讓參加者藉以交流創新意念、建立商業網絡，並探索跨領域商機與市場發展策略。
BODW 2019 詳情: www.bodw.com/sowb_bd!
Business of Design Week (BODW) 2019
Business of Design Week (BODW), Asia’s leading event on design, innovation and brands, will gather outstanding design masters and influential business leaders from around the world in Hong Kong on 2-7 December 2019. In collaboration with its partner country this year – the United Kingdom, one of the world’s greatest cultural nations with a thriving creative sector – BODW 2019 is curated on the theme Design the Future, Create Tomorrow. From fashion to film, architecture to advertising, UK creatives have a well-earned reputation for challenging conventions and embracing the new with professionalism and flair. The UK is also identified by trend forecasters as a key market for new trends to take off globally.
With strong participation from UK creatives and other international experts, the BODW 2019 summit will present a host of forums and panels exploring the latest trends and ideas in branding, communication, product design, digital and technology, spatial design and architecture, culture and city life. The summit provides a mega platform for business and creative leaders to exchange innovative ideas, network, and explore new business opportunities.
Register now for the BODW 2019 at www.bodw.com/sowb_bd !
DFA香港青年設計才俊獎2019
立即報名！
「DFA香港青年設計才俊獎2019」現正接受報名！
只要你是35歲或以下的香港永久性居民，不論是在職設計師或2019年度設計畢業生，即可報名參加。得獎者有機會獲得高達五十萬港元的財政贊助，赴海外知名設計公司實習或院校進修，建立國際視野，進一步提升專業知識。
網上報名及詳情：ydta.dfaawards.com
𝐀𝐩𝐩𝐥𝐲 𝐍𝐎𝐖!
DFA Hong Kong Young Design Talent Award 2019 is 𝐧𝐨𝐰 𝐨𝐩𝐞𝐧 𝐟𝐨𝐫 𝐚𝐩𝐩𝐥𝐢𝐜𝐚𝐭𝐢𝐨𝐧!
Hong Kong permanent residents aged 35 or below who are either designers or 2019 design graduates are eligible to apply. Awardees may receive 𝐟𝐢𝐧𝐚𝐧𝐜𝐢𝐚𝐥 𝐬𝐩𝐨𝐧𝐬𝐨𝐫𝐬𝐡𝐢𝐩 𝐮𝐩 𝐭𝐨 𝐇𝐊$𝟓𝟎𝟎,𝟎𝟎𝟎 to work overseas in reputable design firms or study abroad to further develop and elevate their versatility, resourcefulness and professional knowledge.
Online application and details: ydta.dfaawards.com
BODW 2018 - 掌握最新設計策略 打造出眾品牌
21世紀的品牌策略遠遠不只標誌設計，更重要的是打造生活態度，建立忠實顧客群。今年BODW的「品牌亞洲論壇」帶來全球頂尖的品牌專家，分享以體驗為先的品牌設計策略。講者包括單車品牌Cinelli & Columbus總裁Antonio Colombo、曾為英國設計雜誌Wallpaper*靈魂人物的Tony Chambers等。另外，「傳意與設計」論壇將齊集國際知名傳訊設計大師，如享譽全球的澳洲平面設計界元祖Dr Ken Cato AO、墨爾本新晉平面設計組合Tin&Ed等。立即登記BODW！憑推廣碼SU3ZRG9於11月30日前於網上購票可獲七折優惠，親身參與城中設計盛事！
BODW 2018
日期 Date: 12月3日至8日 December 3-8
地點 Venue: 香港會議展覽中心 Hong Kong Convention and Exhibition Centre
詳情 Details: bodw.com/osf3
BODW 2018 - Build Extraordinary Brands with groundbreaking design strategy
The branding strategy for 21st century goes way beyond logo design. It’s about building up loyalty in customers through shaping a desirable attitude. In this year’s BODW, the “Brand Asia Forum” will gather around top-notch brand experts to share experience-driven brand design strategies. Speakers include Antonio Colombo, President of the bicycle manufacturing brand Cinelli & Columbus; Tony Chambers who brought the British design magazine Wallpaper* to a whole new level. The “Communication & Design” summit will
The 8th Edition of Business of Intellectual Property Asia Forum (BIP Asia) - IP & Innovation in the New Socio-technological Landscape (6-7 December 2018, Thursday - Friday)
Jointly organised by the HKSAR Government, Hong Kong Trade Development Council and Hong Kong Design Centre, the 8th Edition of Business of Intellectual Property Asia Forum (BIP Asia) will bring IP professionals and business leaders from around the world to discuss the latest developments in IP and explore business collaboration opportunities. The Forum last year attracted more than 2,500 IP professionals and industry leaders, featuring over 80 prominent speakers sharing their insights.
As the supporting organisation of the event, members of The Hong Kong Institute of Patent Practitioners are offered a special two-day pass (including Keynote Luncheon on Thursday, 6th December) for HK$720 per person (original price HK$1,800).
Online Registration: Click here to register*
*To enjoy the special rate, please register with full payment and promotional code “BIP2018SO_041”
For more information, please visit BIP Asia Forum website at www.bipasiaforum.com.
第八屆亞洲知識產權營商論壇 - 知識產權與創新：塑造社會及科技發展新形勢 (2018年12月6-7日，星期四至五)
由香港特別行政區政府、香港貿易發展局及香港設計中心合辦的第八屆亞洲知識產權營商論壇將以「知識產權與創新：塑造社會及科技發展新形勢」為題，為世界各地知識產權業的專業人士和商家提供一個理想平台，就知識產權的最新發展互相交流。去年的論壇吸引超過80位星級講者和專家作分享及超過2,500位的業界及專業人士參與。
香港專利代理人公會為亞洲知識產權營商論壇支持機構之一，其會員可以特別價港幣$720（原價港幣$1,800）報名參加（兩天論壇連同12月6日專題午宴）。
網上登記：請按此登記*
*請在登記時輸入折扣代碼“BIP2018SO_041”以享有優惠。
更多論壇資訊,請參閲知識產權營商論壇網站: http://bipasiaforum.com/tc/
The 7th Edition of Business of Intellectual Property Asia Forum (BIP Asia) - IP & nnovation: Propelling Change, Growth and Connectivity (7-8 December 2017, Thursday - Friday)
Jointly organised by the HKSAR Government, Hong Kong Trade Development Council and Hong Kong Design Centre, the 7th Edition of Business of Intellectual Property Asia Forum (BIP Asia) will bring IP professionals and business leaders from around the world to discuss the latest developments in IP and explore business collaboration opportunities. The Forum last year attracted more than 2,500 IP professionals and industry leaders, featuring over 80 prominent speakers sharing their insights.
As the supporting organisation of the event, members of The Hong Kong Institute of Patent Practitioners are offered a special two-day pass (including Keynote Luncheon on Thursday, 7th December) for HK$600 per person (original price HK$1,800).
Online Registration: Click here to register*
*To enjoy the special rate, please register with full payment and promotional code “BIP2017SO_041”
For more information, please visit BIP Asia Forum website at www.bipasiaforum.com<span.
第七屆亞洲知識產權營商論壇 - 知識產權與創新: 推動革新、增長與聯繫 (2017 年12 月7-8 日，星期四至五)
由香港特別行政區政府、香港貿易發展局及香港設計中心合辦的第七屆亞洲知識產權營商論壇將以「知識產權與創新: 推動革新、增長與聯繫」為題，為世界各地知識產權業的專業人士和商家提供一個理想平台，就知識產權的最新發展互相交流。去年的論壇吸引超過80 位星級講者和專家作分享及超過2,500 位的業界及專業人士參與。
香港專利代理人公會為亞洲知識產權營商論壇支持機構之一，其會員可以特別價港幣$600（原價港幣$1,800）報名參加（兩天論壇連同12 月7 日專題午宴）。
網上登記：請按 此登記*
*請在登記時輸入折扣代碼“BIP2017SO_041”以享有優惠。
更多論壇資訊,請參閲知識產權營商論壇網站: http://bipasiaforum.com/tc/
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Event Name :
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APAC Innovation Summit
Robotics
Embedded Artificial Intelligence
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Date :
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5 - 6 June 2017
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Organiser :
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Hong Kong Science and Technology Parks Corporation (HKSTP)
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Venue :
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Grand Hall, Convention Centre 3, Science Park
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Event Website :
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https://apacinnosummit.hkstp.org/en/ais-robotics/
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Contact:
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+852 2629 6840 / +852 2628 6800 / ais.info@hkstp.org
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Event Brief :
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Artificial Intelligence (A.I.) rarely has a physical format but it penetrates into wide segments of our daily lives, with huge implications for a wide range of industries, such as industrial automation, services, transportation and wellness. Any robotics without A.I. is just a tool; only solutions embedded with A.I. would become intelligent, just as human with a brain has the ability to self-learn and even learn from each other. While A.I. is taking the world stage and transforming it in the process, this conference will bring together a world cast of leading experts including academia, decision makers and thought leaders to exchange insights on the latest trends.
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Jointly organised by the Government of the HKSAR, Hong Kong Trade Development Council and Hong Kong Design Centre, the 6th Edition of Business of Intellectual Property Asia Forum (BIP Asia) will bring IP professionals and business leaders from around the world to discuss the latest developments in IP and explore business collaboration opportunities. The Forum last year had attracted more than 2,400 IP professionals and industry players, featuring over 80 heavy-weight speakers to share their insights.
As the supporting organisation of the event, members of The Hong Kong Institute of Patent Practitioners are offered a special two-day pass (including Networking Luncheon on Thursday, 1st December) for HK$600 per person (original price HK$1,800).
Online Registration: Click here to register*
*To enjoy the special rate, please register with full payment and promotional code “BIP2016SO_41”
For more information, please visit BIP Asia Forum website at www.bipasiaforum.com.
第六屆知識產權營商論壇-知識產權：成就創新世代 (2016年12月1-2日，星期四至五)
由香港特別行政區政府、香港貿易發展局及香港設計中心合辦的第六屆亞洲知識產權營商論壇將以「知識產權：成就創新世代」為題，為世界各地知識產權業的專業人士和商家提供一個理想平台，就知識產權的最新發展互相交流。去年的論壇吸引超過80位星級講者和專家作分享及超過2,400位的業界及專業人士參與。
香港專利代理人公會為亞洲知識產權營商論壇支持機構之一，其會員可以特別價港幣$600（原價港幣$1,800）報名參加（兩天論壇連同12月1日專題午宴）。
網上登記：請按此登記*
*請在登記時輸入折扣代碼“BIP2016SO_41”以享有優惠。
更多論壇資訊,請參閲知識產權營商論壇網站: http://bipasiaforum.com/tc/
Asian Licensing Conference 2017:
Date: 9-10 January 2017 (Monday - Tuesday)
Edition: 6th
Venue: Hong Kong Convention and Exhibition Centre, 1 Expo Drive, Wan Chai, Hong Kong
Organiser Hong Kong Trade Development Council
Sponsor International Licensing Industry Merchandisers' Association (LIMA)
The Asian Licensing Conference (ALC) is a leading international licensing conference focused on the promising Asian market. As the largest annual event of its kind in the region, the conference allows participants to identify opportunities in China and Asia, exchange market insights and expand business contacts. The event also provides ample opportunities for cross-sector collaboration and partnership.
For more information, please refer to：http://info.hktdc.com/dm/CP1633770/external/index_en.html
APAC Innovation Summit 2016 , Angel x Angel 2016: International Angel Investment Symposium (11 Nov) and Advanced Materials & Printed Electronics (22 Nov):
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Event Name :
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APAC Innovation Summit 2016 Series – Smart City
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Event Type :
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Conference / Business Matching & Pitching
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Date :
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22 - 23 September 2016
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Time :
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09:30 - 17:30
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Organiser :
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Hong Kong Science and Technology Parks Corporation (HKSTP)
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Venue :
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Grand Hall, Convention Centre 3, Science Park
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Event Website :
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http://www.apacinnosummit.net/
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Contact:
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+852 2629 6908 / info@apacinnosummit.net
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Event Brief :
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A 2-day conference and business matching event focusing on the global megatrend of smart city development and latest trends in smart city technologies and applications – Not to be missed!
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活動名稱：
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《亞太創新峰會2016系列 - 智慧城巿》
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活動類別：
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研討會 / 一對一商業配對活動
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日期 :
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2016年9月22日至23日
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時間 :
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09:30 - 17:30
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主辦者：
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香港科技園公司
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地點：
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香港科學園會展中心3大展覽廳
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活動網站：
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http://www.apacinnosummit.net/
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聯絡方法:
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+852 2629 6908 / info@apacinnosummit.net
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活動簡介：
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為期2天的會議和商業配對活動，專注於智能城市的發展和智慧城市技術與應用的全球最新趨勢- 不容錯過！
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Event Name :
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APAC Innovation Summit 2016 Series – Sensors
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Event Type :
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Conference / Business Matching & Pitching
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Date :
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25 August 2016
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Time :
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09:30 - 17:30
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Organiser :
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Hong Kong Science and Technology Parks Corporation(HKSTP)
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Venue :
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Charles K. Kao Auditorium, Science Park
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Brief Description :
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Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of sensors. Conference Highlights: (i) Emerging sensor technologies (ii) Market trends, industry drivers and development of sensor products (iii) Applications of micro-sensors for wellness and healthcare monitoring, smart city sensing and other new areas (iv) Business matching with sensor technology companies, R&D institutes and users.
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Event Website :
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http://www.apacinnosummit.net/
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Contact:
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+852 2629 6965 / info@apacinnosummit.net
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活動名稱：
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《亞太創新峰會2016系列 - 傳感器技術》
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活動類別：
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研討會 / 一對一商業配對活動
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日期 :
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2016年8月25日
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時間 :
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09:30 - 17:30
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主辦者：
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香港科技園公司
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地點：
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香港科學園高錕會議中心
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簡介：
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雲集來自業界及研究機構的主講嘉賓，這將是一個聚焦傳感器技術、探討新趨勢及機遇的前瞻性會議。會議亮點：(i) 新興傳感器技術 (ii) 傳感器的市場趨勢、行業推動力和產品開發 (iii) 微型傳感器在促進醫療保健、健康監控、智慧城市及其他新領域的應用 (iv) 與傳感器技術企業、研發機構和用戶作商業配對。
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活動網站：
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http://www.apacinnosummit.net/
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聯絡方法:
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+852 2629 6965 / info@apacinnosummit.net
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Event Name :
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APAC Innovation Summit 2016 Series – Robotics
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Event Type :
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Conference / Exhibition
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Date :
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2 -3 June 2016
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Time :
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09:30 - 17:30
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Organiser :
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Hong Kong Science and Technology Parks Corporation (HKSTP)
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Venue :
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Grand Hall, Phase 3, Science Park
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Brief Description :
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Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of robotics.
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Event Website :
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http://www.apacinnosummit.net/
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Contact:
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+852 2629 6766 / info@apacinnosummit.net
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活動名稱：
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《亞太創新峰會2016系列 - 機械人技術》
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活動類別：
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研討會 / 展覽
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日期 :
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2016年6月2 - 3日
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時間 :
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09:30 - 17:30
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主辦者：
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香港科技園公司
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地點：
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香港科學園三期大展覽廳
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簡介：
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雲集來自業界及研究機構的主講嘉賓，這將是一個聚焦機械人技術、探討新趨勢及機遇的前瞻性會議。
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活動網站：
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http://www.apacinnosummit.net/
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聯絡方法:
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+852 2629 6766 / info@apacinnosummit.net
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APAC Innovation Summit 2016 Series – Internet of Things
Connect • Collaborate • Catalyse
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Featuring a number of inspiring keynote speakers and focusing on enabling the ecosystem of re-industrialisation in Hong Kong riding on the opportunities of IoT developmentto foster intelligent manufacturing.
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Date: 7-8 April 2016
Time: 09:30 – 17:00
Venue: Charles K. Kao Auditorium & Hall 04-07, Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Website: http://www.apacinnosummit.net/
Enquiry: +852-2629 6729 / info@apacinnosummit.net
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5th edition of Business of IP Asia Forum – IP: Transforming Global Business
(Thursday - Friday, 3rd - 4th December 2015)
Jointly organised by the Government of the HKSAR, Hong Kong Trade Development Council and Hong Kong Design Centre, the 5th Edition of Business of Intellectual Property Asia Forum (BIP Asia) will bring IP professionals and business leaders from around the world to discuss the latest developments in IP and explore business collaboration opportunities. The Forum last year had attracted over 2,000 industry players from 36 countries and regions to join, featuring over 80 heavy-weight speakers to share their insights.
As the supporting organisation of the event, we are pleased that members of The Hong Kong Institute of Patent Practitioners are offered a special two-day pass (including Networking Luncheon on Thursday, 3rd December) for HK$600 per person (original price HK$1,600).
Online Registration: Click here to register*
*To enjoy the special rate, please register with full payment and promotional code “BIP2015SO_55”
For more information, please visit BIP Asia Forum website at www.bipasiaforum.com.
第五屆知識產權營商論壇- 知識產權：帶領全球轉型
(2015年12月3-4日，星期四至五)
由香港特別行政區政府、香港貿易發展局及香港設計中心合辦的第五屆亞洲知識產權營商論壇將以「知識產權：帶領全球轉型」為題，為世界各地知識產權業的專業人士和商家提供一個理想平台，就知識產權的最新發展互相交流。去年的論壇吸引超過80位星級講者和專家作分享及超過2,000位來自36個國家與地區的業界及專業人士參與。
香港專利代理人公會為亞洲知識產權營商論壇支持機構之一，其會員可以特別價港幣$600（原價港幣$1,600）報名參加（兩天論壇連同12月3日專題午宴）。
網上登記：請按此登記*
*請在登記時輸入折扣代碼“BIP2015SO_55”以享有優惠。
更多論壇資訊,請參閲知識產權營商論壇網站: http://bipasiaforum.com/tc/
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APAC Innovation Summit 2015 Series – Advanced Materials
Connect • Collaborate • Catalyse
The Advanced Materials Conference, under the APAC Innovation Summit 2015 Series, will take place in Science Park in November. As one of the HKSTP’s flagship events, the conference would be an ideal platform to connect all stakeholders, facilitate collaborations and catalyse new ideas and opportunities.
The Advanced Materials Conference will have a number of local and overseas inspiring keynote speakers, influential experts and leading industry players to exchange their latest insights on advanced materials development. Innovative applications of smart materials to electronics and green technologies will also be covered.
Date: Thursday, 26 November 2015
Time: 09:30 – 17:00
Venue: Charles K. Kao Auditorium & Hall 04-07, Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Website: http://www.apacinnosummit.net/
Enquiry: +852-2629 6786/ info@apacinnosummit.net
亞太創新峰會2015系列 – 先進物料
連繫 • 協作 • 促進
香港科學園公司的旗艦活動──《亞太創新峰會》將繼續致力於推動創新和技術，旨在連繫所有相關的持份者，推動協作和促進新的想法及機會。而《亞太創新峰會》系列下第三個焦點「先進物料」會議將於十一月在科學園舉辦。
「先進物料」會議邀請了多位本地及海外具影響力的權威專家及業界先導，分享先進物料的發展趨勢，以及此等物料於電子行業和環保相關行業的創新應用。
日期: 2015年11月26 日
時間: 09:30 – 17:00
地點: 香港科學園高錕會議中心及會議廳04-07
主辦單位: 香港科技園公司
網頁: http://www.apacinnosummit.net/
查詢: +852-2629 6786/ info@apacinnosummit.net
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APAC Innovation Summit 2015 Series – Smart Cities
Connect • Collaborate • Catalyse
The Smart Cities Conference, the 2nd highlight of the APAC Innovation Summit 2015 Series, will take place in Science Park in September. Following the success of the last event in Robotics of the series, this flagship event of Hong Kong Science and Technology Parks Corporation continues its commitment to promote innovation and technology and aims to connect all stakeholders, facilitate collaboration and catalyse new ideas and opportunities. The Smart Cities Conference will feature a number of inspiring keynote speakers and influential smart city thinkers and doers from both local and overseas to exchange their latest insights on smart cities development, smart transportation system, green and smart buildings, energy management and low impact development. The event will also showcase a mini-exhibition of the latest innovations and technology from research community and industry.
Date: 22-23 September 2015
Time: 09:30 – 17:30
Venue: Charles K. Kao Auditorium, Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Website: http://www.apacinnosummit.net/
Enquiry: +852-2629 6780/info@apacinnosummit.net
亞太創新峰會2015系列 – 智能城巿
連繫 • 協作 • 促進
繼「機械人技術」會議後，《亞太創新峰會》系列的第二個焦點「 智能城市」會議將於九月在科學園舉辦。作為香港科技園公司的旗艦活動，《亞太創新峰會》將繼續致力於推動創新和技術，目的是連繫所有相關的持份者，推動協作和促進新的想法及機會。「智能城市」會議將會請來多位本地及海外著名演講嘉賓及具影響力的專家，分享智能城市的潮流，以及在智能運輸系統、環保與智能建築、能源管理及低影響發展模式（ Low Impact Development）等方面的應用。活動為期兩天，同時還會舉行一個小型展覽會，展出來自學界、科研機構及業界的最新創新科技及產品。
日期: 2015年9月22-23 日
時間: 09:30 – 17:30
地點: 香港科學園高錕會議中心
主辦單位: 香港科技園公司
網頁: http://www.apacinnosummit.net/
查詢: +852-2629 6780/info@apacinnosummit.net
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APAC Innovation Summit 2015 Series - Robotics
Connect • Collaborate • Catalyse
With an aim to connect all stakeholders, facilitate collaboration and catalyse new ideas and opportunities, APAC Innovation Summit, the flagship event of Hong Kong Science and Technology Parks Corporation, adopts a thematic approach covering 5 major technology areas with a series of events spreading over Year 2015-2016. The upcoming “Robotics” series in June will gather a panel of world-renowned experts to share on the robotics technology trend and its applications in homecare, edutainment, industrial automation and medical field. The 2-day event will also feature a mini-exhibition to showcase the latest innovations from academia, research community and industry.
Date: 24 - 25 June 2015
Time: 09:30 – 17:30
Venue: Grand Hall, Hong Kong Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Website: http://www.apacinnosummit.net/
Enquiry: +852-26296840 / info@apacinnosummit.net
亞太創新峰會2015系列 - 機械人技術
連繫 • 協作 • 促進
《亞太創新峰會》是香港科技園公司每年一度的旗艦活動，旨在滙聚業內相關的人物，從中推動創新思維並促成合作的機會。在2015-2016年度的峰會中，香港科學園將會跨年舉辦五個主題會議，議題覆蓋五個重要技術範疇。而快將於六月舉行的「機械人技術」會議，將會請來一眾蜚聲國際的專家，分享機械科技的潮流，以及在家庭護理、教育娛樂、工業自動化及醫療等方面的應用。該活動為期兩天，同時還會舉行一個小型展覽會，展出來自學界、科研機構及業界的最新創新科技及產品。
日期: 2015年6月24 - 25 日
時間: 09:30 – 17:30
地點: 香港科學園展覽廳
主辦單位: 香港科技園公司
網頁: http://www.apacinnosummit.net/
查詢: +852-26296840 / info@apacinnosummit.net
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4-5 December 2014 – Business of IP Asia Forum, the Hong Kong Trade Development Council and the Hong Kong Design Centre
HIPP sponsored the BIP Asia Forum which was held at Hong Kong Convention & Exhibition Centre in Hong Kong.
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5-6 December 2013 – Business of IP Asia Forum, the Hong Kong Trade Development Council and the Hong Kong Design Centre
HIPP sponsored the BIP Asia Forum which was held at Hong Kong Convention & Exhibition Centre in Hong Kong.
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7 December 2012 – Business of IP Asia Forum, the Hong Kong Trade Development Council and the Hong Kong Design Centre
HIPP sponsored the BIP Asia Forum which was held at Hong Kong Convention & Exhibition Centre in Hong Kong.
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15 November 2012 – Joint Reception for FICPI/SEAD Course tutors and participants
HIPP organized this Joint Reception with FICPI/SEAD Course and with the sponsorship of Edwards Wildman Palmer LLP (EWP).
Ip. Peter Cheung (Director of the Intellectual Property Department of the HKSAR) and Dr. Claudia Xu (Director of the Technology Transfer Center of HKUST) both members of the Patent Review Advisory Committee, discussed their view with HIPP members during the reception.
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2 Aug 2010 – Seminar & Panel Discussion: Commercializing Your Technology
HIPP organized this mini-conference with the Hong Kong Science and Technology Park
Ms. Karen Wang (Director of Invotex) and Mr. Patrick Yi (CEO of MediPurpose) shared their experience on the financial aspectsof licensing at the Hong Kong Science Park.
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Ms. Wang was sharing her experience in the seminar
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7 May 2010 – "Aligning IP with Growth of Biopharmaceutical Company: the FibroGen Experience" Seminar
HIPP organized this event with the Hong Kong Science and Technology Park and the Hong Kong Biotechnology Organization.
Dr. James E. Nesbitt and Dr. Christopher Turner (Directors of Intellectual Property at Fibrogen,Inc.) shared their experience at the Hong Kong Science Park.
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Dr. Turner was sharing his experience in the seminar
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